SEPAREL® Membrane Degassing Technology and eFlow®Anti-Static Device

Avoid Dust Re-adhering and Prevent Static Electricity Damage to the Substrate Pattern with SEPAREL® Hollow-Fiber Membrane Degassing Modules

semiconductor-wafersSEPAREL membrane degassing technology can help reduce the stationary charge that builds up on the surface of a material. For example, electrostatic overstress (EOS) and electrostatic discharge (ESD) can lead to field failures in semiconductors.

The SEPAREL membrane degassing module and eFLOW Series may help to control the specific resistance value of ultra-pure water by supplying carbon dioxide through a hollow fiber gas permeable membrane uniquely developed by DIC.

This makes it possible to avoid dust re-adhering, and to prevent static electricity damage to the substrate pattern.

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The SEPAREL Difference

  • The simple structure results in few breakdowns.
  • Unique pipe distribution system controls the specific resistance value and has excellent stability.
  • Long lifespan of the carbon dioxide gas injection module.

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 Custom Specifications/Devices

  • Clean specification (flow rate up to 30 L/min)
  • Low specific resistance (0.25 to 0.05 MΩ·cm) types
  • Small/separate electrical section types
  • Large flow rate (100 L/min) types
  • Other types, customizable

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Major Applications

  • Mask, reticle cleaning
  • Scrubber cleaning
  • High-pressure jet cleaning
  • Cleaning in the dicing stage
  • Cell cleaning

Learn more about SEPAREL® liquid degassing technology.

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Other Liquid Degassing Technology Applications