Resins for BPA & BPF Epoxies, Flame Retardant Epoxies, Novolac Epoxies and Hardeners, and High Performance Epoxies

Sun Chemical offers a wide variety of epoxy resins for the coatings, civil engineering, adhesives, electrical insulating materials, composites, molding materials, semiconductor encapsulants, automotive, and aerospace markets.

BPA and BPF Type Epoxy Resins

DIC’s EPICLON® BPA and BPF epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates.

Key attributes and features:

• Broad portfolio of liquid, solid and solution types
• Low chlorine content
• Distilled grades for ultra low viscosity and high purity

Flame Retardant Epoxy Resins and Hardeners

DIC offers EPICLON® flame retardant epoxy resins and hardeners with various chemical concepts to satisfy the individual customer needs. These include brominated resins (LBR and HBR), phosphorous resins and hardeners, ATN hardeners and other halogen-free types. Main usages are in electric and electronic, adhesives, as well as in composite applications.

Key attributes and features:

• Various concepts of FR resins and hardeners
• Excellent flame retardancy
• High performance types available
• Can work without additional fillers and additives
• Available as solid or in solution

Novolac Epoxy Resins and Hardeners

DIC’s EPICLON® novolac epoxy resins and PHENOLITE hardeners are used in multiple electric and electronics, adhesives, as well as composite applications. We offer serval types of novolac resins and hardeners, from standard phenol novolacs over cresol novolacs to high performance modified and DCPD type novolacs.

Key attributes and features:

• Broad range of functionality and EEW
• High TG grades
• Low halogen content
• Low moisture absorption
• Outstanding electric parameters
• Excellent mechanical parameters

High Performance Epoxy Resins and Hardeners

DIC’s EPICLON® high performance epoxy resins and hardeners are widely used in molding materials, semiconductor encapsulants, electrical laminates, as well as automotive and aerospace composites. By their unique chemical structures, these high performance epoxy resins provide sophisticated properties to bring electric and electronics, adhesives, and composite applications to the next level.

Key attributes and features:

• Excel in heat, chemical and water resistance
• Outstanding ductility and bonding properties
• Ultra high TG
• Very low dielectric constant and dissipation factor
• High mechanical toughness